- Kaynes has a strong team for Process design in all stages of Manufacturing
- Lean Manufacturing techniques are adopted at different stages for better
- Kaynes Technical team has the understanding of various Hardware and Software platforms available across the industry along with Application specific requirements
- Kaynes has carried out more than 40 Technology Transfers globally into India
- Kaynes has separate Technical Teams for Electronics, Mechanical, Manufacturing Infrastructure and Manufacturing Process at all Stages
- Kaynes has the Technical competence to Design and develop , Jigs , Fixtures , Test benches and Simulators for Manufacturing and Testing Processes
- Kaynes has the competence for Building Custom Functional Simulators and Testers to meet the needs of Product Qualification and Validation
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STANDARD NAME
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DESCRIPTION
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| 1 | IPC-A-600 | For Acceptability Of Printed Circuit Boards |
| 2 | IPC-A-610 | For Acceptability Of Printed Board Assemblies |
| 3 | JESD 625 | Requirements for Handling Electrostatic-Discharge-Sensitive (ESDs) Devises |
| 4 | IPC-7095 | Design and Assembly Process Implementation for BGAs |
| 5 | IPC-7912 | Calculation Of DPMO and Manufacturing Indices for Printed Board Assemblies |
| 6 | IPC-7525 | Stencil Design Guidelines |
| 7 | IPC/EIA J-STD-001 * | Requirements for Soldered Electrical and Electronic Assemblies |
| 8 | IPC/JEDEC J-STD-033 | Handling,Packing,Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices |
| 9 | IPC-HDBK-830 | Guidelines for Design, Selection and Application of Conformal Coatings |
| 10 | IPC – 7711 / 7721 | Rework of Electronic Assemblies / Repair and Modification of Printed BDS and Electronic Assemblies |
| 11 | IPC-T-50 | Terms and Definitions for Interconnecting and Packaging Electronic Circuits |
| 12 | IPC TM 650 | IPC test Methods – Manual |
| 13 | ANSI/ASQ Z1.4-2003 /IS 2500 | Sampling Procedures and Tables for Inspection By Attributes |
| 14 | IPC-7530 | Guidelines for Temperature Profiling for Mass Soldering Process (Reflow and Wave Soldering) |
| 15 | AS55553 | Counterfeit Electronic Parts; Avoidance, Detection, Mitigation, and Disposition |
| 16 | ESD TR53-01-06 | Compliance Verification of ESD Protective Equipment and Materials |
| 17 | ANSI/ESD S20.20-2007 | Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices) |
| 18 | ANSI/ESD S541-2008 | Packaging Materials for ESD Sensitive Items |
| 19 | JSTD 001 | Requirements for Soldered Electrical and Electronic Assemblies |
| 20 | JSTD 002 | Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires |
| 21 | JSTD 003 | Solderability Tests for Printed Boards |
| 22 | JSTD 004 | Requirements for Soldering Fluxes |
| 23 | JSTD 005 | Requirements for Soldering Pastes |
| 24 | JSTD 006 | Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders |
| 25 | IPCA WHMA 620 | Requirements and Acceptance for Cable and Wire Harness Assemblies |
| 26 | IEC 61340-5-1.0 | Protection of electronic devices from electrostatic phenomena |