Manufacturing Capabilities

Manufacturing Capabilities

• 6 SMT Lines capable with laser marker
• 2D Barcodes with Max size 110 mm

Surface Mount
Laser Marker

• 3D inline SPI with 2 Microns Height accuracy
• Max PCB size handling of 510 mm X 460 mm

Surface Mount
3D SPI

• Designed for Lead-Free Soldering
• Auto Chip Pick-up, Auto Reflow, Top and Bottom Convection Heating

BGA Rework & Reballing

• Maximum magnification of 6000x & High penetration of 160kV
• 3D viewing capabilities with CT Scan

X-Ray Inspection

• Dual pitch selection system (2.5 mm & 5 mm)
• 0.36 sec / component tact time
• Max PCB size handling of 330 x 250 mm

Through Hole
Auto Insertion Machine

• Separate Wave Soldering Machines for R0HS & Non RoHS
• Dual wave soldering capability
  

Wave Soldering

• 457mm x 508mm Maximum PCB Handling Size
• Flux Level Sensor
• Auto Fiducial Recognition and Correction System

Selective Soldering

• Dual wash tank
• 508 mm x 381 mm Maximum PCB Handling Size
• 2.75 meters (9 feet) dynamic was section

Cleaning Machine

• Control of aqueous and semi-aqueous cleaning processes
• Cleanliness testing of performance-sensitive small parts

Ionic Contamination Tester

• Zoom ratio of 1:6.4
• 180mm Long Working Distance

Manual Inspection with
Stereo Microscope

• 302,500 components/hr total placement capacity
• Minimum size 01005 Component package handling capability
• Max PCB size handling of 610x508 mm
• Pin in Paste Process capability

Surface Mount
Pick and Place

• Nitrogen controlled environment
• 350 C maximum set point temperature
• Compatible of Non RoHS and RoHS Compliant soldering capabilities

Surface Mount
Reflow

• Five 4 Mega Pixel Digital Color Camera In-Line AOI System
• Integrated INTELLI-SCAN Laser Inspection System
• Inspects solderability issues, missed components, legend Mark & Component Shift
• Has OCR capabilities

Surface Mount
3D AOI

• Configurable for ICT, boundary scan, ISP, flash programming, and functional test
• Built-in calibration standards module and self-test circuits
• High precision measurements of analog components

In circuit Testing

• Testing unit with 4 flying probes on one side
• On-board programming, boundary scan test, visual tests
• Offline Programming and Repair stations
• Barcode and 2D-code reading management

Flying Probe Testing

Testing Capabilities

• Board level Functional Testing
• Product Specific Functional Testing
• In-Circuit Testing

Manual testing facility with specific adaptors and jigs to match, for speed up testing, with AC/DC power supplies frequency counters, Digital millimeters, waveform analysis ,Digital storage oscilloscope, and LCR bridges.